THErmal ORganic Enhanced Material

Funding program: 


Total budget: 

2.669 M€

Project duration: 



Reduce weight in embedded systems by replacing metal cowlings by covers made of composite materials.


Composite materials are very poor heat conductors. Besides its protection function, the metal cover of  electronics plays an important role in dissipating heat generated by electronic cards. Excessive heat would induce efficiency loss of the embedded system.

THEOREM project, worth € 3 million, has been certified by the AESE innovation center and funded by the 9th FUI Call for Projects. It gathers around TSA several research laboratories, subcontracting SMEs and RESCOLL.

RESCOLL will bring its expertise in formulation of  composite matrix materials to confer them thermal conductivity properties and, if necessary, electrical functionalities.